Semiconductor package and method of fabricating semiconductor package

ABSTRACT

A method of fabricating a semiconductor package includes providing a substrate having at least one contact and forming a redistribution layer on the substrate. The formation of the redistribution layer includes forming a dielectric material layer over the substrate and performing a double exposure process to the dielectric material layer. A development process is then performed and a dual damascene opening is formed in the dielectric material layer. A seed metallic layer is formed over the dual damascene opening and over the dielectric material layer. A metal layer is formed over the seed metallic layer. A redistribution pattern is formed in the first dual damascene opening and is electrically connected with the at least one contact.

BACKGROUND

Packaging technologies for integrated circuits involve encapsulating anintegrated circuit (IC) die in encapsulation material and building therequired redistribution layer. The formation of fin-pitch redistributionlayers allows for fabricating smaller packages with high integration.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-7 schematically illustrate various stages of processes forforming a redistribution layer according to a method of fabricating asemiconductor package in accordance with some embodiments.

FIGS. 8-14 schematically illustrate various stages of processes forforming another redistribution layer according to a method offabricating a semiconductor package in accordance with some embodiments.

FIG. 15 illustrates a schematic layout top view of a redistributionlayer in a semiconductor package in accordance with some embodiments.

FIG. 16 schematically illustrates a semiconductor package having one ormore redistribution layers in accordance with some embodiments.

FIGS. 17-20 schematically illustrate various stages of a method offabricating a semiconductor package in accordance with some embodiments.

FIG. 21 schematically illustrates a semiconductor package having one ormore redistribution layers in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one component or feature's relationship toanother component(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

Other features and processes may also be included. For example, testingstructures may be included to aid in the verification testing of the 3Dpackaging or 3DIC devices. The testing structures may include, forexample, test pads formed in a redistribution layer or on a substratethat allows the testing of the 3D packaging or 3DIC, the use of probesand/or probe cards, and the like. The verification testing may beperformed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

FIGS. 1-7 schematically illustrate various stages of processes forforming a redistribution layer according to a method of fabricating asemiconductor package in accordance with some embodiments. Referring toFIG. 1, a substrate 102 having a plurality of contacts 104 is provided.In some embodiments, a first dielectric material layer 110 is formedover the substrate 100 and covering the contacts 104. In someembodiments, the substrate 102 may include one or more semiconductorchips or plural dies of a semiconductor wafer or a reconstituted wafer.In certain embodiments, the substrate 102 is a reconstituted waferincluding a plurality of dies molded in a molding compound. In someembodiments, the contacts 104 are contact pads or conductive pads of thedie(s). In some embodiments, the substrate 102 may be a monocrystallinesemiconductor substrate such as a silicon substrate, asilicon-on-insulator (SOI) substrate or a germanium-on-insulator (GOI)substrate, for example. In accordance with the embodiments, thesemiconductor substrate may include other conductive layers, dopedregions or other semiconductor elements, such as transistors, diodes orthe like. The embodiments are intended for illustration purposes but notintended to limit the scope of the present disclosure.

Referring to FIG. 1, in some embodiments, the first dielectric materiallayer 110 may be formed by a coating process such as spin-coatingprocess, or a deposition process including a chemical vapor deposition(CVD) process. In certain embodiments, the first dielectric materiallayer 110 may be a positive photo-sensitive material layer. In someembodiments, a material of the dielectric material layer 110 may be apositive type photo-sensitive material, including polyimide,benzocyclobutene (BCB), polybenzooxazole (PBO), or any other suitablephoto-sensitive polymer materials or other photoresist materials. Incertain embodiments, the material of the dielectric material layer 110may be a positive photoresist material, and the positive photoresistmaterials may be H-line, I-line, wide-band or deep-UV photoresistmaterials.

Referring to FIG. 2, a first exposure process E1 is performed to thefirst dielectric material layer 110 to form first exposure portions110A. In some embodiments, the first exposure process E1 is performedusing a mask MK1 with a first pattern PT1, with light or illumination(as arrows) radiated from a light source (not shown) passing through themask MK1. In some embodiments, the first pattern PT1 includes aplurality of openings PTO1. In certain embodiments, the image of thefirst pattern PT1 is transferred to the first dielectric material layer110 through the first exposure process E1. In FIG. 2, the firstdielectric material layer 110 is partially exposed by the light orillumination through the first exposure process E1, and the firstexposure portions 110A are formed in the exposed regions (shown as thespotted regions) of the first dielectric material layer 110 exposed tothe light passing through the openings PTO1. In some embodiments, byadjusting the energy level or energy dose of the energy source (i.e.light source) and/or the exposure time, the depth of the exposureregions (the depth that light can reach) may be accurately controlled.In some embodiments, the first exposure process E1 is performed with afirst energy dose, and the first exposure portions 110A are formed witha depth d1 and a bottom size S1 in the horizontal direction x(perpendicular to the thickness direction z of the first dielectricmaterial layer 110). In certain embodiments, the depth d1 of the firstexposure portions 110A is substantially equivalent to a thickness T1 ofthe first dielectric material layer 110. In certain embodiments, thethickness T1 of the first dielectric material layer 110 ranges fromabout 10 microns to about 30 microns, and the first energy dose rangesfrom about 50 mJ/cm² to about 100 mJ/cm². In some embodiments, the firstexposure portions 110A constitute a latent pattern and the latentpattern is a reproduce of the first pattern PT1. That is, the locationsand shapes of the first exposure portions 110A correspond to andsimulate substantially the locations and shapes of the openings PTO1. Insome embodiments, the latent pattern of the first exposure portions 110Aincludes a via-opening pattern. In accordance with the embodiments, theimage of the pattern(s) of the mask will be transferred fully orpartially to the target material layer or structure in any specificratio for amplification or reduction purposes. The embodiments areintended for illustration purposes but not intended to limit the scopeof the present disclosure.

For the positive photo-sensitive material or positive photoresistmaterial, exposure to light of a suitable wavelength (which is materialdependent) leads to chemical reactions of the positive photo-sensitivematerial or positive photoresist material, and the treated portions willbecome more soluble or be much easier to be removed during thesubsequently development process. In some embodiments, as the firstdielectric material layer 110 is a positive photo-sensitive materiallayer, the first exposure portions 110A of the first dielectric materiallayer 110 are chemically reacted and become soluble during thesubsequently development process.

Referring to FIG. 3, a second exposure process E2 is performed to thefirst dielectric material layer 110 to form second exposure portions110B. In some embodiments, the second exposure process E2 is performedusing a mask MK2 with a second pattern PT2, with light or illumination(as arrows) passing through the mask MK2. In some embodiments, the masksMK1, MK2 may refer to different portions of the same mask or two masks.In some embodiments, the second pattern PT2 includes a plurality ofopenings PTT1. In certain embodiments, the image of the second patternPT2 is transferred to the first dielectric material layer 110 throughthe second exposure process E2. In FIG. 3, the first dielectric materiallayer 110 is partially exposed by the light or illumination through thesecond exposure process E2, and the second exposure portions 110B areformed in the exposed regions (shown as the spotted regions) of thefirst dielectric material layer 110 exposed to the light passing throughthe openings PTT1. In certain embodiments, the locations and shapes ofthe second exposure portions 110B correspond to and simulatesubstantially the locations and shapes of the openings PTT1. In someembodiments, the second exposure process E2 is performed with a secondenergy dose and the second exposure portions 110B are formed with adepth d2 and a bottom size S2 in the horizontal direction x(perpendicular to the thickness direction z of the first dielectricmaterial layer 110). In certain embodiments, the depth d2 of the secondexposure portions 110B is smaller than the thickness T1 of the firstdielectric material layer 110. In certain embodiments, the depth d2 ofthe second exposure portions 110B is smaller than the depth d1 of thefirst exposure portions 110A. In one embodiment, the second energy doseis lower than the first energy dose. In some embodiments, the secondenergy dose ranges from about 50 mJ/cm² to about 100 mJ/cm². In someembodiments, the second exposure portions 110B constitute a latentpattern and the latent pattern is a reproduce of the second pattern PT2.In some embodiments, the ratio of depth d2/d1 may be about 0.4˜0.6. Insome embodiments, the locations of the first exposure portions 110A areoverlapped with the locations of parts of the second exposure portions110B. In some embodiments, the latent pattern of the second exposureportions 110B includes a trench-opening pattern.

In some embodiments, the first exposure process E1 and the secondexposure process E2 can be considered as a double exposure process. Incertain embodiments, only one photo-sensitive dielectric material layeris needed for such double exposure process, the process steps of suchdouble exposure process are much simplified when compared withconventional photolithographic exposure processes performed twice, thuslowering the costs and saving time for the formation of theredistribution layer (RDL).

In some embodiments, by performing two consecutive exposure processes,better exposure alignment for the patterns and more accurate patternoverlay (especially RDL to the vias) can be achieved. In certainembodiments, the same mask is used for performing the two consecutiveexposure processes, only once mask alignment is required and no extraalignment is required and better pattern overlay is attained.

In FIG. 4, in some embodiments, a first development process is conductedto remove the first and second exposure portions 110A, 110B of the firstdielectric material layer 110, and the first dielectric pattern 111 isformed, thus implementing the pattern transfer of masks MK1, MK2. Insome embodiments, the first development process includes applying adeveloper solution to dissolve or remove at least the exposed regionsduring the first and second exposure processes E1, E2 (i.e. the firstand second exposure portions 110A, 110B) so as to expose the underlyingcontacts 104. For example, the developer solution includes solutions oftetramethyl ammonium hydroxide (TMAH). In some embodiments, thedeveloped first dielectric pattern 111 is then cured under 200-250degrees Celsius. In some embodiments, the first and second exposureportions 110A, 110B may be removed simultaneously by the samedevelopment process. In certain embodiments, following the removal of atleast the first and second exposure portions 110A, 110B, the trenchopenings TS1 with the depth d4 and the via openings VS1 with the depthd3 are formed and the first dielectric pattern 111 having the thicknessT2 is formed. In some embodiments, film loss may occur during the firstdevelopment process and the thickness T2 of the first dielectric pattern111 is smaller than the thickness T1 of the first dielectric materiallayer 110. In certain embodiments, the trench openings TS1 and the viaopenings VS1 correspondingly and spatially communicated with the trenchopenings TS1 constitute dual damascene openings or damascene openingsDS1. In some embodiments, only some of trench openings TS1 are connectedwith some of the via openings VS1 to form the damascene openings DS1. Insome embodiments, some of trench openings TS1 are not connected withsome of the via openings VS1.

In some embodiments, in addition to the removal of the first and secondexposure portions 110A, 110B, the first development process may includeover-developing the first dielectric material layer 110 by removing thefirst dielectric material layer 110 excessively around the first andsecond exposure portions 110A, 110B to form the via openings VS1 andtrench openings TS1 as well as the damascene openings DS1 as shown inFIG. 4. In some embodiments, similar to the isotropic etching process,the over-developing of the first dielectric material layer 110 furtherwiden the openings. In addition, a curing process may be included tocure the first dielectric material layer 110, and the curing of thefirst dielectric material layer 110 makes the sidewalls of the openingsinclined. In some embodiments, owing to the over-developing and curing,the via opening VS1 is formed with a depth d3 and a bottom size S3 inthe horizontal direction x (perpendicular to the thickness direction z),and the trench opening TS1 is formed with a depth d4 and a bottom sizeS4 in the horizontal direction x. In some embodiments, the trenchopenings TS1, the via openings VS1 and the damascene openings DS1 becometapering with slanted sidewalls. In some embodiments, the bottom size S3of the via openings VS1 is larger than the bottom size S1 of the firstexposure portions 110A. In some embodiments, the bottom size S4 of thetrench openings TS1 is larger than the bottom size S2 of the secondexposure portions 110B. In some embodiments, the depth d3 is smallerthan the depth d1, while the depth d4 is smaller than the depth d2. Insome embodiments, the ratio of depth d4/d3 may be about 0.4˜0.6. In someembodiments, the ratio of bottom sizes S3/S1 is equivalent to 1.5 orlarger than 1.5. In some embodiments, the ratio of bottom sizes S4/S2 isequivalent to 1.5 or larger than 1.5. In some embodiments, the viaopening VS1 is a round shaped opening and the bottom size S3 of the viaopening VS1 is the largest dimension or the diameter of the via openingVS1. In some embodiments, the trench opening TS1 is a strip trench andthe bottom size S4 of the trench opening TS1 is the largest dimension orthe length in the length direction (marked as direction x in FIG. 4).

Referring to FIG. 5, in some embodiments, a first seed metallic layer120 is formed over the first dielectric pattern 111 having damasceneopenings DS1 and on the contacts 104. In some embodiments, the firstseed metallic layer 120 is formed conformal to the profiles of the firstdielectric pattern 111 with damascene openings DS1, evenly covering thesidewalls and bottom surfaces of the damascene openings DS1 and the topsurface of the first dielectric pattern 111. In certain embodiments, thefirst seed metallic layer 120 is formed by chemical vapor deposition(CVD), physical vapor deposition (PVD), atomic layer deposition (ALD),high density plasma CVD (HDPCVD) or combinations thereof. In certainembodiments, the first seed metallic layer 120 is formed by sequentiallydepositing or sputtering a titanium layer and a copper layer (not shown)conformal to the first dielectric pattern 111 and the damascene openingsDS1. In one embodiment, the first seed metallic layer 120 covers and isin contact with the exposed surfaces of the contacts 104 (i.e. bottomsurfaces of the via openings VS1). In certain embodiments, for thetrench openings TS1 that are not connected with the via openings VS1,the first seed metallic layer 120 is formed conformally covering thesidewalls and bottom surfaces of the trench openings TS1. Owing to theslant or inclined sidewalls of the openings TS1, VS1 or DS1, better andmore uniform step coverage may be achieved, especially for the firstseed metallic layer 120 formed by sputtering. Hence, the reliability andelectrical performance of the redistribution layer/structure are furtherimproved.

Referring to FIG. 6, a first metal layer 130 is formed to fill up thedamascene openings DS1 and on the first seed metallic layer 120 over thefirst dielectric pattern 111. In some embodiments, the formation of thefirst metal layer 130 including forming a copper layer or a copper alloylayer (not shown) by electroplating to fill the damascene openings DS1and on the first seed metallic layer 120 over the first dielectricpattern 111. However, it is appreciated that the scope of thisdisclosure is not limited to the materials and descriptions disclosedabove. In certain embodiments, for the trench openings TS1 that are notconnected with the via openings VS1, the first metal layer 130 is formedfilling up the trench openings TS1.

In some embodiments, as a conformal seed layer is formed before fillingthe metal layer into the openings, better adhesion is ensured for thelater formed metal layer. Moreover, the conformal seed layer may assistlowering the resistance and improving electrical properties for theredistribution layer.

Referring to FIG. 7, a planarization process is performed to partiallyremove the first metal layer 130 and the first seed metallic layer 120above the top surface 111 a of the first dielectric pattern 111. In someembodiments, the first metal layer 130 along with the first seedmetallic layer 120 above the top surface 111 a of the first dielectricpattern 111 are removed until the top surface 111 a of the firstdielectric pattern 111 is exposed, and first seed metallic patterns 121and dual damascene redistribution patterns 131 filled within thedamascene openings DS1 are formed. In some embodiments, theplanarization process may include a chemical-mechanical polishing (CMP)process, a mechanical grinding process, a fly cutting process or anetching back process. In some embodiments, the planarization process mayinclude a chemical-mechanical polishing (CMP) process or a fly cuttingprocess. In certain embodiments, after planarization, the formation ofthe first redistribution layer (RDL1) within the package structure 100is completed. In some embodiments, after planarization, the first seedmetallic layer 120 and the first metal layer 130 remained within thedamascene openings DS1 become the first seed metallic patterns 121 anddual damascene redistribution patterns 131. In some embodiments, thefirst seed metallic pattern 121 is located with the damascene openingDS1, sandwiched between the dual damascene redistribution pattern 131and the damascene openings DS1, and conformally covers the sidewalls andbottom surface of the damascene openings DS1. In some embodiments, thefirst seed metallic pattern 121 located with the damascene opening DS1is formed as an integral piece as the first seed metallic patterns 121are formed from the same layer (first seed metallic layer 120).

In some embodiments, the first redistribution layer RDL1 includes atleast the first dielectric pattern 111, the first seed metallic patterns121 and the dual damascene redistribution patterns 131. The firstredistribution layer RDL1 is electrically connected with the contacts104 of the substrate 102. In alternative embodiments, the firstredistribution layer RDL1 may include more than one dielectric patternsand various types of redistribution patterns including traces orconnection lines. In exemplary embodiments, the layout of theredistribution patterns of the first redistribution layer RDL1 may formfan-out routings for an integrated fan-out (InFO) package structure.

In some embodiments, the dual damascene redistribution pattern 131located with the damascene opening DS1 includes via portions 132(located within the via openings VS1) and routing portions 133 (locatedwithin the trench openings TS1). In some embodiments, the top surface111 a of the first dielectric pattern 111 is coplanar with and flushwith the top surfaces 131 a of the dual damascene redistributionpatterns 131. In certain embodiments, for the trench openings TS1 thatare not connected with the via openings VS1, after planarizing the firstmetal layer filling up the trench openings TS1, trace patterns (notshown) remained in the trench openings TS1 are obtained.

In certain embodiments, following the above process steps, the firstredistribution layer is accomplished without using photolithographicprocesses and etching processes, thus avoiding the issues of photoresistpeeling or swelling. In some embodiments, using the double exposureprocess described above, better pattern overlay and better patternalignment are offered and damascene openings including via openings andtrench openings are formed. In certain embodiments, through theformation of the damascene openings, filling capability of the metallayer into the damascene openings is improved and better adhesionbetween the damascene openings and the dual damascene redistributionpatterns is provided through first seed metallic patterns 121 formedthere-between.

FIGS. 8-14 schematically illustrate various stages of processes forforming another redistribution layer according to a method offabricating a semiconductor package in accordance with some embodiments.

Referring to FIG. 8, in some embodiments, a second dielectric materiallayer 140 may be formed on the first redistribution layer RDL1. Thefirst redistribution layer RDL1 may be formed following some or allprocesses as described in FIGS. 1-7. In some embodiments, the seconddielectric material layer 140 may be formed by a coating process such asa spin-coating process, or a deposition process including a CVD process.In certain embodiments, the second dielectric material layer 140 may bea positive type photo-sensitive material layer. In some embodiments, amaterial of the dielectric material layer 140 may be a positivephoto-sensitive material, including polyimide, BCB, PBO, or any othersuitable photo-sensitive polymer materials or other photoresistmaterials. In certain embodiments, the material of the dielectricmaterial layer 140 may be positive photoresist materials. In someembodiments, the material of the second dielectric material layer 140 isthe same as that of the first dielectric material layer 110. In someembodiments, the material of the second dielectric material layer 140 isdifferent from that of the first dielectric material layer 110.

Referring to FIG. 9, a third exposure process E3 is performed to thesecond dielectric material layer 140 to form third exposure portions140A. In some embodiments, the third exposure process E3 is performedusing a mask MK3 with a third pattern PT3. In some embodiments, thethird exposure portions 140A are formed in the exposed regions (shown asthe spotted regions) of the second dielectric material layer 140 exposedto the light passing through the openings PTO2. The third exposureprocess E3 may be performed under similar or same conditions asdescribed in the first exposure process E1, and will not repeatedherein. In some embodiments, the third exposure process E3 is performedwith a third energy dose, and the third exposure portions 140A areformed with a depth d5 and a bottom size S5 in the horizontal directionx (perpendicular to the thickness direction z of the second dielectricmaterial layer 140). In certain embodiments, the depth d5 of the thirdexposure portions 140A is substantially equivalent to a thickness T3 ofthe second dielectric material layer 140. In certain embodiments, thelatent pattern of the third exposure portions 140A includes avia-opening pattern. In accordance with the embodiments, the pattern ofthe third exposure portions 140A is different from the pattern of thefirst exposure portions 110A. The embodiments are intended forillustration purposes but not intended to limit the scope of the presentdisclosure.

Referring to FIG. 10, a fourth exposure process E4 is performed to thesecond dielectric material layer 140 to form fourth exposure portions140B. In some embodiments, the fourth exposure process E4 is performedusing a mask MK4 with a fourth pattern PT4. In some embodiments, themasks MK3, MK4 may refer to different portions of the same mask or twomasks. The fourth exposure process E4 may be performed under similar orsame conditions as described in the second exposure process E2, and willnot repeated herein. In FIG. 10, the second dielectric material layer140 is partially exposed by the fourth exposure process E4, and thefourth exposure portions 140B are formed in the exposed regions (shownas the spotted regions) of the second dielectric material layer 140exposed to the light passing through the openings PTT2 of the fourthpattern PT4. In some embodiments, the fourth exposure process E4 isperformed with a fourth energy dose and the fourth exposure portions140B are formed with a depth d6 and a bottom size S6 in the horizontaldirection x (perpendicular to the thickness direction z). In certainembodiments, the depth d6 of the fourth exposure portions 140B issmaller than the thickness T3 of the second dielectric material layer140. In certain embodiments, the depth d6 of the fourth exposureportions 140B is smaller than the depth d5 of the third exposureportions 140A. In one embodiments, the fourth energy dose is lower thanthe third energy dose. In some embodiments, the ratio of depth d6/d5 maybe about 0.4˜0.6. In some embodiments, the locations of the thirdexposure portions 140A are overlapped with the locations of parts of thefourth exposure portions 140B. In some embodiments, the latent patternof the fourth exposure portions 140B includes a trench-opening pattern.

In some embodiments, the third exposure process E3 and the fourthexposure process E4 can be considered as another double exposureprocess.

In FIG. 11, in some embodiments, a second development process isconducted to remove at least the third and fourth exposure portions140A, 140B of the second dielectric material layer 140, and the seconddielectric pattern 141 is formed. The second development process may beperformed using similar or same conditions or materials as described inthe first development process, and will not repeated herein. In someembodiments, the third and fourth exposure portions 140A, 140B may beremoved simultaneously by the same development process. In certainembodiments, following the removal of at least the third and fourthexposure portions 140A, 140B, the trench openings TS2 with a depth d8and the via openings VS2 with a depth d7 are formed and the seconddielectric pattern 141 having the thickness T4 is formed. In someembodiments, film loss may occur during the second development processand the thickness T4 of the second dielectric pattern 141 is smallerthan the thickness T3 of the second dielectric material layer 140. Incertain embodiments, the trench openings TS2 and the via openings VS2correspondingly and spatially communicated with the trench openings TS2constitute dual damascene openings or damascene openings DS2. In someembodiments, some of trench openings TS2 are connected with some of thevia openings VS2. In some embodiments, some of trench openings TS2 arenot connected with some of the via openings VS2.

In some embodiments, other than the removal of the third and fourthexposure portions 140A, 140B, the second development process may includeover-developing the second dielectric material layer 140 by removing thesecond dielectric material layer 140 excessively around the third andfourth exposure portions 140A, 140B to form the via openings VS2 andtrench openings TS2 as well as the damascene openings DS2. In someembodiments, the over-developing of the second dielectric material layer140 further widen the openings. In addition, a curing process may beincluded, and the curing of the second dielectric material layer 140makes the sidewalls of the openings inclined. In some embodiments, owingto the widening effect of over-developing, the via opening VS2 is formedwith a bottom size S7 (in the horizontal direction x) wider than thebottom size S5 of the third exposure portions 140A, and the trenchopening TS2 is formed with a bottom size S8 (measuring at the depth d8in the horizontal direction x) wider than the bottom size S6 of thefourth exposure portions 140B. In some embodiments, the trench openingsTS2, the via openings VS2 and the damascene openings DS2 become taperingwith slanted sidewalls after the curing process. In some embodiments,the depth d7 is smaller than the depth d5, while the depth d8 is smallerthan the depth d6. In some embodiments, the ratio of depth d8/d7 may beabout 0.4˜0.6. In some embodiments, the ratio of bottom sizes S7/S5ranges from 1.1 to 2. In some embodiments, the ratio of bottom sizesS8/S6 ranges from 1.1 to 2. In some embodiments, the via openings VS2expose the underlying dual damascene redistribution patterns 131. Insome embodiments, the via opening VS2 is a round shaped opening and thebottom size S7 of the via opening VS2 is the largest dimension or thediameter of the via opening VS2. In some embodiments, the trench openingTS2 is a strip trench and the bottom size S8 of the trench opening TS2is the largest dimension or the length in the length direction (markedas direction x in FIG. 11).

Referring to FIG. 12, in some embodiments, a second seed metallic layer150 is formed over the second dielectric pattern 141 having damasceneopenings DS2. In some embodiments, the second seed metallic layer 150 isformed conformal to the profiles of the second dielectric pattern 141with damascene openings DS2, evenly covering the sidewalls and bottomsurfaces of the damascene openings DS2 and the top surface of the seconddielectric pattern 141. In certain embodiments, the second seed metalliclayer 150 is formed by sequentially depositing or sputtering a titaniumlayer and a copper layer (not shown) conformal to the second dielectricpattern 141 and the damascene openings DS2. In one embodiment, thesecond seed metallic layer 150 covers and is in contact with the exposedsurfaces of the dual damascene redistribution patterns 131 (i.e. bottomsurfaces of the via openings VS2). Owing to the slant or inclinedsidewalls of the openings TS2, VS2 or DS2, better and more uniform stepcoverage may be achieved for the second seed metallic layer 150. Hence,the reliability and electrical performance of the redistributionlayer/structure are further improved.

Referring to FIG. 13, a second metal layer 160 is formed to fill up thedamascene openings DS2 and on the second seed metallic layer 150 overthe second dielectric pattern 141. In some embodiments, the material ofthe second metal layer 160 includes copper or copper alloys. In someembodiments, the material of the second metal layer 160 is the same ordifferent from that of the first metal layer 130.

Referring to FIG. 14, a planarization process is performed to partiallyremove the second metal layer 160 and the second seed metallic layer 150above the top surface 141 a of the second dielectric pattern 141, andsecond seed metallic patterns 151 and dual damascene redistributionpatterns 161 filled within the damascene openings DS2 are formed. Incertain embodiments, after planarization, the formation of the secondredistribution layer (RDL2) in the package structure 100 is completed.In some embodiments, the second seed metallic pattern 151 is locatedwith the damascene opening DS2, sandwiched between the dual damasceneredistribution pattern 161 and the damascene openings DS2, andconformally covers the sidewalls and bottom surface of the damasceneopenings DS2. In some embodiments, the second seed metallic pattern 151is formed as an integral piece located with the damascene opening DS2.The second redistribution layer RDL2 is disposed on the firstredistribution layer RDL1 and is electrically connected with the firstredistribution layer RDL1.

In FIG. 14, the dual damascene redistribution pattern 161 located withthe damascene opening DS2 includes via portions 162 (located within thevia openings VS2) and routing portions 163 (located within the trenchopenings TS2).

FIG. 15 illustrates a schematic layout top view of a redistributionlayer in a semiconductor package in accordance with some embodiments. InFIG. 15, more than one dual damascene redistribution patterns 161 areshown. In some embodiments, some of the dual damascene redistributionpattern 161 includes two via portions 162 connected through the routingportion 163 located in-between. However, the pattern of the dualdamascene redistribution pattern or the layout of the redistributionlayer is not limited by the embodiments described herein.

FIG. 16 schematically illustrates a semiconductor package having one ormore redistribution layers in accordance with some embodiments. In someembodiments, after the formation of the second redistribution layerRDL2, the package structure 100 may undergo a dicing process and thepackage structure 100 is cut into a plurality of packages 10. Referringto FIG. 16, the package 10 includes a package subunit 1500 having amolding compound 1560 and at least one die 1500 and through inter-layervias (TIVs) 1520 molded in the molding compound 1560. In someembodiments, the first redistribution layer RDL1 is disposed on themolding compound 1560 and on the die 1510 and the TIVs 1520. In someembodiments, the first redistribution layer RDL1 is electricallyconnected with the contact pads 1512 of the die 1510 and the TIVs 1520.The second redistribution layer RDL2 is disposed on the firstredistribution layer RDL1 and is electrically connected with the firstredistribution layer RDL1. The structure shown in FIG. 16 may be formedfollowing the processes described in FIGS. 1-14, except for replacingthe substrate 102 with the molded package subunit 1500. In someembodiments, the molded package subunit 1500 is provided without theTIVs 1520.

FIGS. 17-20 schematically illustrate various stages of a method offabricating a semiconductor package in accordance with some embodiments.Referring to FIG. 17, a package structure 200 having at least a firstredistribution layer RDL1, a second redistribution layer RDL2 and athird redistribution layer RDL3 is provided. The formation of the thirdredistribution layer RDL3 is similar to the formation of the firstredistribution layer RDL1 and the second redistribution layer RDL2. Insome embodiments, the third redistribution layer RDL3 may be formed byforming a third dielectric pattern 211, forming third seed metallicpatterns 220 and then forming the dual damascene redistribution patterns231.

Referring to FIG. 18, a passivation layer 240 with openings S is formedover the third redistribution layer RDL3 to partially expose the dualdamascene redistribution patterns 231.

Referring to FIG. 19, conductive elements 250 are formed on the exposedsurfaces of the dual damascene redistribution patterns 231 within theopenings S of the passivation layer 240.

In some embodiments, after the formation of the conductive elements 250on the third redistribution layer RDL3, the package structure 200 mayundergo a dicing process and the package structure 200 is cut into aplurality of packages 20 (only one is shown), in FIG. 20.

Referring to FIG. 21, the package 20A includes at least a firstredistribution layer RDL1, a second redistribution layer RDL2 and athird redistribution layer RDL3, and the redistribution layers RDL1-RDL3may be formed following the processes as described in FIGS. 1-14. Insome embodiments, the planarization processes performed to remove theextra first, second or third metal layer includes an etching process.Due to the etching back process(es) performed during the formation ofthe redistribution layers RDL1-RDL3, the top surfaces 131 a, 161 a, 231a of the dual damascene redistribution patterns 131, 161, 231 are lowerthan the top surfaces 111 a, 141 a, 211 a of the dielectric patterns111, 141, 211.

In accordance with some embodiments of the present disclosure, asemiconductor package has at least a redistribution layer located on asubstrate. The redistribution layer is electrically connected withcontacts of the substrate. The redistribution layer includes adielectric pattern having a dual damascene opening and a redistributionpattern disposed within the dual damascene opening. The redistributionlayer includes a seed metallic pattern sandwiched between the dualdamascene opening and the redistribution pattern.

In accordance with alternative embodiments of the present disclosure, amethod of fabricating a semiconductor package includes at least thefollowing steps. A substrate having at least one contact is provided anda redistribution layer is formed on the substrate. The formation of theredistribution layer includes forming a dielectric material layer overthe substrate and performing a double exposure process to the dielectricmaterial layer. A development process is then performed and a dualdamascene opening is formed in the dielectric material layer. A seedmetallic layer is formed over the dual damascene opening and over thedielectric material layer. A metal layer is formed over the seedmetallic layer. A redistribution pattern is formed in the first dualdamascene opening and is electrically connected with the at least onecontact.

In accordance with alternative embodiments of the present disclosure, amethod of fabricating a semiconductor package includes at least thefollowing steps. A substrate having contacts is provided. A firstdielectric material layer is formed over the substrate. A first doubleexposure process is performed to the first dielectric material layer. Afirst development process is performed and a first dual damasceneopening is formed in the first dielectric material layer exposing thecontacts. A first seed metallic layer is formed over the first dualdamascene opening and over the first dielectric material layer. A firstmetal layer is formed on the first seed metallic layer. A firstredistribution layer having a first redistribution pattern is formed inthe first dual damascene opening. A second dielectric material layer isformed over the first redistribution layer. A second double exposureprocess is performed to the second dielectric material layer. A seconddevelopment process is performed and a second dual damascene opening isformed in the second dielectric material layer. A second seed metalliclayer is formed over the second dual damascene opening and over thesecond dielectric material layer. A second metal layer is formed on thesecond seed metallic layer. A second redistribution layer having asecond redistribution pattern is formed in the second dual damasceneopening.

In accordance with alternative embodiments of the present disclosure, amethod of fabricating a redistribution layer includes at least thefollowing steps. A substrate having contacts is provided. A dielectricmaterial layer is formed on the substrate. A first exposure process isperformed with a first energy dose to form first exposure portions witha first depth in the dielectric material layer. A second exposureprocess is performed with a second energy dose to form second exposureportions with a second depth in the dielectric material layer. The firstdepth is larger than the second depth and the first energy dose islarger than the second energy dose. The first exposure portions andsecond exposure portions of the dielectric material layer are removed atthe same time to form via openings and trench openings respectively. Aseed metallic layer is formed over the dielectric material layer andcovers the via openings and trench openings. A metal layer is formedover the seed metallic layer and fills the via openings and the trenchopenings.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method of forming a semiconductor package, comprising: providing asubstrate having at least one contact; and forming a redistributionlayer on the substrate, wherein forming the redistribution layercomprises: forming a dielectric material layer over the substrate;performing a double exposure process to the dielectric material layer,wherein performing the double exposure process comprises performing afirst exposure process to form first exposure portions in the dielectricmaterial layer and performing a second exposure process to form secondexposure portions in the dielectric material layer; performing adevelopment process and forming a dual damascene opening in thedielectric material layer, wherein performing the development processand forming the dual damascene opening in the dielectric material layercomprises over-developing the dielectric material layer by applying adeveloper solution to form a via opening wider than the first exposureportions and form a trench opening wider than the second exposureportions; forming a seed metallic layer over the dual damascene openingand over the dielectric material layer; forming a metal layer over theseed metallic layer; and forming a redistribution pattern located in thedual damascene opening and electrically connected with the at least onecontact.
 2. The method as claimed in claim 1, wherein the first exposureportions are formed with a first depth in the dielectric material layerand the second exposure portions are formed with a second depth in thedielectric material layer, and the first depth is larger than the seconddepth.
 3. The method as claimed in claim 2, wherein locations of thefirst exposure portions are overlapped with locations of the secondexposure portions.
 4. (canceled)
 5. The method as claimed in claim 1,wherein performing a double exposure process to the dielectric materiallayer comprises performing the first exposure process with a firstenergy dose and performing the second exposure process with a secondenergy dose to the dielectric material layer, and the first energy doseis larger than the second energy dose.
 6. The method as claimed in claim1, wherein the seed metallic layer is formed conformally covering thedual damascene opening and covering the dielectric material layer. 7.The method as claimed in claim 1, wherein forming a redistributionpattern located in the dual damascene opening comprises performing aplanarization process to remove the metal layer and the seed metalliclayer outside the dual damascene opening.
 8. A method of fabricatingforming a semiconductor package, comprising: providing a substratehaving contacts; and forming a first dielectric material layer over thesubstrate; performing a first double exposure process to the firstdielectric material layer to form first exposure portions and secondexposure portions in the first dielectric material layer; performing afirst development process and forming a first dual damascene opening inthe first dielectric material layer exposing the contacts, whereinperforming the first development process and forming the first dualdamascene opening in the first dielectric material layer comprisesover-developing the first dielectric material layer by applying adeveloper solution to form a via opening wider than the first exposureportions and form a trench opening wider than the second exposureportions; forming a first seed metallic layer over the first dualdamascene opening and over the first dielectric material layer; forminga first metal layer on the first seed metallic layer; forming a firstredistribution layer having a first redistribution pattern in the firstdual damascene opening; forming a second dielectric material layer overthe first redistribution layer; performing a second double exposureprocess to the second dielectric material layer; performing a seconddevelopment process and forming a second dual damascene opening in thesecond dielectric material layer; forming a second seed metallic layerover the second dual damascene opening and over the second dielectricmaterial layer; forming a second metal layer on the second seed metalliclayer; and forming a second redistribution layer having a secondredistribution pattern in the second dual damascene opening.
 9. Themethod as claimed in claim 8, wherein performing a first double exposureprocess to the first dielectric material layer comprises performing afirst exposure process with a first energy dose and performing a secondexposure process with a second energy dose to the first dielectricmaterial layer, and the first energy dose is larger than the secondenergy dose.
 10. The method as claimed in claim 8, wherein forming afirst redistribution layer having a first redistribution pattern in thefirst dual damascene opening comprises performing a planarizationprocess to remove the first metal layer and the first seed metalliclayer outside the first dual damascene opening to form a first seedmetallic pattern covering the first dual damascene opening and the firstredistribution pattern filled up the first dual damascene opening. 11.The method as claimed in claim 8, wherein performing a second doubleexposure process to the second dielectric material layer comprisesperforming a third exposure process with a third energy dose andperforming a fourth exposure process with a fourth energy dose to thesecond dielectric material layer, and the third energy dose is largerthan the fourth energy dose.
 12. The method as claimed in claim 8,wherein forming a second redistribution layer having a secondredistribution pattern in the second dual damascene opening comprisesperforming a planarization process to remove the second metal layer andthe second seed metallic layer outside the second dual damascene openingto form a second seed metallic pattern covering the second dualdamascene opening and the second redistribution pattern filled up thesecond dual damascene opening.
 13. A method of forming a redistributionlayer, comprising: providing a substrate having contacts; and forming adielectric material layer on the substrate; performing a first exposureprocess with a first energy dose to form first exposure portions with afirst depth in the dielectric material layer; performing a secondexposure process with a second energy dose to form second exposureportions with a second depth in the dielectric material layer, whereinthe first depth is larger than the second depth and the first energydose is larger than the second energy dose; removing the first exposureportions and second exposure portions of the dielectric material layerat the same time to form via openings and trench openings respectively,wherein removing the first exposure portions and second exposureportions of the dielectric material layer at the same time comprisesperforming a development process to remove the first and second exposureportions and over-developing the dielectric material layer around thefirst and second exposure portions by applying a developer solution toform the via openings larger than first exposure portions and the trenchopenings larger than that of the second exposure portions; forming aseed metallic layer over the dielectric material layer and covering thevia openings and trench openings; and forming a metal layer over theseed metallic layer and filling the via openings and the trenchopenings.
 14. The method as claimed in claim 13, further comprisingperforming a planarization process to remove the metal layer and theseed metallic layer outside the via openings and the trench openings.15. The method as claimed in claim 13, wherein locations of the firstexposure portions are overlapped with locations of the second exposureportions.
 16. (canceled)
 17. The method as claimed in claim 13, whereinperforming the development process further comprising a curing process.18. The method as claimed in claim 13, wherein the seed metallic layeris formed conformally covering the via openings and the trench openings.19. The method as claimed in claim 13, wherein the seed metallic layerincluding titanium and copper is formed by sputtering and the metallayer including copper is formed by electroplating.
 20. The method asclaimed in claim 13, wherein the seed metallic layer is formed to coverthe contacts exposed by the via openings.